初稿截稿日期：2019-07-24

1. High-Speed and Broadband Wireless Technologies
? Broadband Fixed Wireless and Last-Mile Access
? Ultra-High Data Rate Communications Links - Powerline
Communication Technologies
? 3G/4G/5G Wireless Communication Services
? Ultra-Wideband (UWB) Systems
? Optical Networks and Systems
2. Emerging Wireless Technologies and Applications
? M2M & V2V Technologies & Applications
? Resource Management, Security
? Femtocell and Heterogeneous Networks
? Green, Sustainable Wireless Tech. & Networks
3. Wireless System Architecture and Modeling
? Ad Hoc Network Techniques for Internetworking
? Distributed Network Architectures and Systems
? Wireless Mesh and Broadband Local/Personal/ Body Area
Networks
? Wireless Security and RFID Technologies
4. Propagation/Channel Modeling and Utilization
? Propagation/Channel Characterization & Modeling -
Fading Countermeasures
? Spectrum Sensing Technologies
? Frequency and Channel Allocation Algorithms
5. Digital Signal Processing, SDR, & Cognitive
Radio
? Digital/Analog Adaptive/Collaborative Signal Processing
? Methods for Signal Integrity and Signal Conditioning
? Interference Mitigation and Cancellation Techniques
? Software/Hardware architectures, Algorithms
? MAC, Networking protocols, Policies, Standardization
? Dynamic Spectrum Sharing, Coexistence, Interoperability
6. Applications to Bio-medical, Environmental,
and Internet of Things
? Miniaturization and Integration of Wireless Technologies
? Personal Area Networks and Body area Sensor
Networks
? Wireless Positioning Technologies & Remote Sensing
7. MIMO and Multi-Antenna Communications
? MIMO, MU-MIMO, Space-Time Processing - Relaying
Technologies
? Cooperative/Collaborative Technology
? Multi-Beam Smart Antennas
8. Antenna Technologies
? Passive & Active Antennas from RF to THz Frequencies
? Miniaturized, Multi-frequency and Broadband Antennas
? Wireless Platform Integrated Antennas
9. Transceiver & Front-end Technologies,
SOC & SiP
? Receiver, Transmitter and Transceiver Components -
Active Circuits and Sub-systems
? Multi-Standard Circuits and Sub-systems
? Low-Power/Low Noise RF/Analog IC and SoC-Chip
? Highly Integrated Transceivers for Sensing and Imaging
10. Passive Components & Packaging
? Discrete, Embedded and Distributed Passive
Components, Filters, Couplers and Signal Separation
Devices
? Discrete and Highly Integrated Packaging
? 3D-Packaging, Interconnects, and Applications
? Packaging of MEMs, Biosensors, Organic ICs, etc.
11. MM-Wave to THz Technology & Applications
? Device and Circuit Concept & Demonstration
? Unique Receivers and Transmitters - Integrated Circuits
? Wireless Links, Arrays & Applications
12. 3D & Novel Engineered Materials
? Additive 3D Manufacturing for Wireless Applications
? Novel Engineered Materials for Antenna, Packaging